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EVG®620 BA

Use the EVG620 bond alignment system for wafer-to-wafer alignment for wafer sizes up to 150 mm. The tool benefits from the high precision manual alignment stage for which EVG bond alignment systems are recognised, is user-friendly and flexible. Thanks to the precision of this EVG bond alignment system, challenging alignment processes can be accommodated; such as 3D integration applications, and MEMS production.

Features

  • Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
  • Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
  • Manual or motorized alignment stage
  • Fully motorized high-resolution bottom-side microscopes
  • Windows® based user interface
  • Quick tool change between different wafer sizes and different bonding applications
  • Options
  • Automatic alignment
  • IR alignment for inner substrate key alignment
  • NanoAlign® package for enhanced process capabilities
  • Available with system rack
  • Upgrade possibility to mask aligner