EVG®820
For the lamination of any type of dry adhesive film onto the carrier wafer, the EVG820 provides a stress free, automated solution. Using unique lamination technology, the adhesive tape is punched, before alignment and lamination. The material this lamination station uses is typically double side adhesive tape. The dimension and size of tape can be chosen freely, independent of the substrate.
Features
- Automated, stress-free and void-free lamination of any kind of dry adhesive film onto the carrier wafer
- Precision-aligned lamination on carrier wafer
- Protective liner peel-off
- The dry film lamination station can be integrated into an EVG®850 TB temporary bonding system
