EVG®850 LT
The EVG850 LT is an automated production bonding system which is designed for mechanically aligned SOI and direct wafer bonding, using LowTemp™ plasma activation. In combining the essential fusion bonding steps – including cleaning, plasma activation and alignment, IR inspection and pre-bonding – the EVG850 LT provides a high-throughput and high-yield production process for SOI wafers, with a 300mm capability. This makes it a key enabler for SOI wafer fabrication, and wafer-level 3D integration.
Features
- SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
- Suitable for a wide range of fusion/molecular wafer bonding applications
- Production system built to operate in high-throughput, high-yield environments
- Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
- Contamination-free backside handling
- Megasonic and/or brush cleaning
- Pre-bonding with mechanical flat or notch alignment
- Advanced remote diagnostics
