EVG®105

The EVG105 bake module is suitable for performing the post-exposure bake, softbake and hardbake processes, and offers uniform evaporation thanks to a controlled baking environment. Temperature profiles and resist hardening processes benefit from the best obtainable control, provided by programmable proximity pins. The EVG105 is able to process up to four 100 mm wafers or up to 300 mm wafer sizes concurrently.

Features

• Stand-alone bake module
• Up to 300 mm wafer size or up to four 100 mm wafers at the same time
• Temperature uniformity ≤ ± 1 °C @ 100 °C, up to 250 °C bake temperature 
• Loading pins for manual and safe wafer loading/unloading
• Timer for bake
• Substrate vacuum (direct contact bake)
• N2 purge and proximity bake 0-1 mm distance wafer to heat plate optional
• Irregular shaped substrates