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EVG®620 NT

The EVG620 is recognised for its flexibility and reliability, providing updated art mask alignment technology on a minimal footprint area. It also offers an optimised total cost of ownership and advanced alignment features. The tool is ideally suited to optical double side lithography, and is available in semi-automated or automated configuration, with the option of a full housing Gen 2 solution that meets fab regulations and requirements for high volume production.

The product includes operator-friendly software, and enables tooling and mask changes to be made in a minimised time. It comes with global service and support; being ideal for a broad variety of manufacturing environments. These mask alignment systems offer integrated vibration isolation, and can attain superb exposure results for a number of applications – including; patterning of deep cavities and comparable topographies, exposure of both thick and thin resists, and processing of compound semiconductors, as well as other fragile or thin materials. Both semi-automated and fully automated system configurations support EVG’s SmartNIL technology.

Features

  • Wafer/substrate size from pieces up to 150 mm/6’’
  • System design supporting versatility of lithography processes
  • Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
  • Automated contact-free wedge compensation sequence with proximity spacers
  • Auto origin function for precise centering of alignment key
  • Dynamic alignment function featuring real-time offset correction
  • Supports the latest UV-LED technology
  • Rework sorting wafer management & flexible cassette system
  • Manual substrate loading capability on automated system
  • Field upgradeable from semi-automated to fully automated version
  • Minimized system footprint and facility requirements
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Advanced SW features and compatibility between R&D and full-scale production
  • Agile processing and conversion re-tooling
  • Remote tech support and SECS/GEM compatibility
  • Additional capabilities:
  • Bond alignment
  • IR alignment
  • Nanoimprint lithography (NIL)