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HERCULES

HERCULES is based on a modular platform, combining integrated wafer cleaning, baking, resist coating and resist development modules with EVG’s widely recognised optical mask alignment technology.  The platform allows the cassette-to-cassette processing of several wafer sizes. Securely handling thick, rectangular, highly bowed, small-diameter wafers – as well as even device trays – HERCULES offers precision top and bottom-side alignment. It enables the coating of sub-micron to ultra-thick resists of up to 300 microns for passivation and interlayer applications. Exposure results at high throughput and highly accurate alignment can be achieved by the superior alignment stage design.

Features

  • Production platform combines all advantages of EVG’s precision alignment and resist processing systems in a minimized footprint
  • Versatile platform supports fully automated processing of various substrate shapes, sizes, highly warped mold wafers and even trays
  • Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 microns in height
  • CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity
  • OmniSpray® coating for optimized coating of high topography surfaces
  • NanoSpray® for coating and protection of via structures
  • Automated mask handling and storage
  • Optical edge exposure and/or solvent cleaning for edge bead removal
  • Fragile, thin or warped wafer handling of multiple wafer sizes with bridge-tool system
  • Rework sorting wafer management and flexible cassette system
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)