EVG®20
The live imaging offered by the EVG20 provides a quick inspection method which is designed for fusion bonded wafers. Void detection down to a 0.5mm radius is supported by a complete view of the wafer through IR transmission. This infrared inspection system is the ideal technology for fusion bonding; as a station in an EVG integrated bonding system, or as a standalone tool.
Features
- Live imaging
- One-shot inspection of the entire wafer
- Optional bond pin for live visualization of direct bonding
- Maszara test compatible
- Void size detection down to 0.5 mm radius
